Micro/Nano Electronic Packaging and Advanced Manufacturing Masters, PhD, and Postdoc Positions at Harbin Institute of Technology (Shenzhen) Harbin Institute of Technology (Shenzhen) in China

The research group at Harbin Institute of Technology (Shenzhen), China, is recruiting Master's, PhD students, and Postdoctoral Researchers to work on innovative topics in micro/nano electronic packaging and advanced manufacturing. The group focuses on cutting-edge research areas such as lithography-free micro/nano fabrication, advanced semiconductor packaging and reliability, ultrathin 3D device integration, flexible electronics, and electrostatic printing. These topics are highly relevant to materials science, mechanical engineering, physics, and chemistry.

Applicants should have a background in Materials Sciences, Physics, Chemistry, Mechanical Engineering, or related fields. Strong English communication and academic writing skills are essential. PhD and Postdoc candidates must have publications. The group values motivated, collaborative, and research-driven individuals.

Multiple scholarships are available for Master's and PhD students, including the HITSZ Entrance Scholarship (tuition waiver and stipend), Shenzhen Universiade Scholarship (CNY 35,000–40,000/year), Guangdong Government Scholarship (CNY 20,000–30,000/year), HITSZ Merit Scholarship (up to CNY 35,000–42,000/year, performance based), and the Chinese Government (CSC) Scholarship, which offers a full tuition waiver and a monthly stipend (Master's CNY 3,000; PhD CNY 3,500). Postdoctoral researchers benefit from a competitive salary (≥ RMB 320,000/year), insurance, housing fund, publication/patent bonuses, Shenzhen housing subsidies or talent apartments, and additional fellowships.

To apply, interested candidates should send a detailed CV and research statement to [email protected]. This is an excellent opportunity for students and researchers interested in advanced manufacturing, micro/nano fabrication, and related fields to join a leading research group in China.