PhD Internship in IC Packaging Structural Engineering (Mechanical Engineering, Microelectronics) Sandisk in United States

Sandisk is offering a paid summer internship for PhD students specializing in Mechanical Engineering or related fields, with a focus on IC Packaging Structural Engineering. The position is based in Milpitas, California, and is designed for students graduating in 2027 who are interested in the microelectronics packaging industry. Interns will join the Packaging R&D group, working on testing, modeling, and simulation across semiconductor packaging, flash memory products, and host levels. Key responsibilities include conducting simulation tasks of mechanical responses, advancing simulation tools for multiscale and multiphysics problems, analyzing and reporting results, and proposing engineering solutions to challenges in the data storage industry.

Applicants should be proficient in CAD and CAE tools, have experience with programming languages, and demonstrate strong work ethics. Exceptional communication skills are preferred. The role offers the opportunity to interface with various teams, including package and product design, materials engineering, electrical and physical characterization, lab testing, failure analysis, assembly R&D, and reliability. The internship provides hands-on experience in innovative solutions for small form-factor packages, denser interconnects, and higher reliability requirements.

Sandisk is recognized globally for its innovation in flash and advanced memory technologies and is committed to diversity and inclusion. The company provides equal opportunities to all applicants and employees. The anticipated application deadline is May 5, 2026. Interested candidates should apply through the SmartRecruiters link provided in the announcement.