Publisher
source

Dr T Gu

1 year ago

Green Electronic Interconnections (GEI): Optimal Design for Lead-free Solder Joints in Advanced Microelectronic Packaging Xi’an Jiaotong-Liverpool University in China

Degree Level

PhD

Field of study

Materials Science

Funding

Fully Funded

Deadline

Expired

Country flag

Country

China

University

Xi’an Jiaotong-Liverpool University

Social connections

How do Indian students apply for this?

Sign in for free to reveal details, requirements, and source links.

Where to contact

Official Email

Keywords

Materials Science
Semiconductor Physics
Civil Engineering
Creative Arts
Microstructure Analysis
Language Proficiency
Microelectronics
Green Technology
University Studies
Technical Engineering
Computational Modelling

About this position

Solder joint is a critical element for interconnecting components in advanced electronic packaging in Semiconductor and lead (Pb)-free solder joint is a prerequisite for Green Electronic Interconnections (GEI). Today, Pb-containing solders still dominate part of high-reliability industrial usage such as integrated circuits, chips, quantum computer components, electrification systems for aerospace and automotive, and control units for nuclear energy facilities. Therefore, developing innovative Pb-free solders towards GEI to replace the existing Pb-containing solders is significantly important due to its known toxicity and health & environment impacts. As demands for multifunction, high-performance and low-cost devices increase, there is a great need to consider device miniaturisation in microelectronics. This study will investigate new methodologies for solder joints, through conducting microstructure control & component fabrication, performing micromechanical testing & microstructural characterisation, and developing computational modelling & microstructural design, to design optimal Pb-free solder joint microstructures and establish a new approach guided for their formation during processing in the application of advanced microelectronic packaging.

For more information about doctoral scholarship and PhD programme at Xi’an Jiaotong-Liverpool University (XJTLU), please visit:

http://www.xjtlu.edu.cn/en/study-with-us/admissions/entry-requirements

http://www.xjtlu.edu.cn/en/admissions/phd/feesscholarships.html

Supervisors:

  • Principal supervisor: Dr Tianhong Gu (XJTLU)
  • Co-supervisor: Prof Konstantinos Papadikis (XJTLU)
  • Co-supervisor: Prof Karl Whittle (UoL)
  • Co-supervisor: Dr Maulik Patel (UoL)

Requirements:

The candidate should have an undergraduate degree with a first-class or upper second-class honours degree, and/or a master’s degree with distinction or merit. For Chinese universities, GPA = 3.5/4.0 or 80-85/100) (or equivalent qualification) in Materials Science and Engineering or relative fields in Engineering and Science. The candidate is desirable to be familiar with relevant techniques in microstructure characterisation, e.g. SEM and TEM, and thermomechanical testing, e.g. tensile, fatigue, and compression, as well as having hands-on experience with computational simulation, e.g. Matlab and Abaqus.

Evidence of good spoken and written English is essential. The candidate should have an IELTS score of 6.5 or above (or TOEFL of 79 and above) if the first language is not English. This position is open to all qualified candidates irrespective of nationality.

Degree:

The student will be awarded a PhD degree from the University of Liverpool (UK) upon successful completion of the program.

Funding:

The PhD studentship is available for three years subject to satisfactory progress by the student. The award covers tuition fees for three years (currently equivalent to RMB 99,000 per annum) and provides a monthly stipend of 5,000 RMB as a contribution to living expenses. It also provides up to RMB 16,500 to allow participation at international conferences during the period of the award. It is a condition of the award that holders of XJTLU PhD scholarships carry out 300-500 hours of teaching assistance work per year. The scholarship holder is expected to carry out the major part of his or her research at XJTLU in Suzhou, China. However, he or she is eligible for a research study visit to the University of Liverpool of up to six months, if this is required by the project.

How to Apply:

Interested applicants are advised to email the following documents for initial review and assessment (please put the project title in the subject line).

  • CV
  • Two reference letters with company/university letterhead
  • Personal statement outlining your interest in the position
  • Proof of English language proficiency (an IELTS score of 6.5 or above)
  • Verified school transcripts in both Chinese and English (for international students, only the English version is required)
  • Verified certificates of education qualifications in both Chinese and English (for international students, only the English version is required)
  • PDF copy of Master Degree dissertation (or an equivalent writing sample) and examiners reports available

Informal enquiries may be addressed to Dr Tianhong Gu (email ), whose personal profile is linked below:

https://www.xjtlu.edu.cn/en/study/departments/design-school/civilengineering/department-staff/academic-staff/staff/tianhong-gu .

Funding details

Fully Funded

How to apply

? Interested applicants should email [email protected] with required documents.

Ask ApplyKite AI

Start chatting
Can you summarize this position?
What qualifications are required for this position?
How should I prepare my application?

Professors