Xin Fu Tan
1 month ago
PhD in Materials Science and Mechanical Engineering: Electronic Interconnects under Extreme Thermal Cycling The University of Queensland in Australia
Degree Level
PhD
Field of study
Mechanical Engineering
Funding
This is a fully funded PhD scholarship supported by the Research Project Scholarship, which includes a living stipend of $37,500 per annum (tax free, 2026 rate, indexed annually) and full tuition fee coverage.
Deadline
Apr 19, 2026
Country
Australia
University
The University of Queensland

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About this position
The University of Queensland is offering a fully funded PhD scholarship in the School of Mechanical and Mining Engineering, focusing on the development of novel electronic interconnects for reliability under extreme thermal cycling. This research aims to create robust interconnect materials with exceptional cryogenic ductility, capable of withstanding severe temperature fluctuations without fracture, which is critical for advanced technologies in aerospace, energy, electric vehicles, and advanced manufacturing.
The project will provide the successful candidate with access to state-of-the-art facilities, including a foundry for sample fabrication, metallography and mechanical testing laboratories, electron microscopes, X-ray characterisation, and synchrotron facilities. Collaborative research opportunities are available with industry partners in Brisbane and Japan, as well as visits to national and international research facilities. Training in both specialist and transferable skills relevant to the project is included.
Applicants should have a strong background in materials science, metallurgy, or mechanical engineering, with experience in alloy design, mechanical properties testing, X-ray diffraction, electron microscopy, and DFT simulation highly desirable. The selection process is competitive and considers academic record, publication history, honours, awards, and employment experience. A working knowledge of academic research and soldering is beneficial.
The scholarship provides a living stipend of $37,500 per annum (tax free, 2026 rate, indexed annually) and covers tuition fees. The application deadline is 19 April, 2026. To apply, submit an expression of interest (EOI) including the project and scholarship details as specified in the advertisement. For further information or to discuss suitability, contact Dr Xin Fu Tan at [email protected].
Funding details
This is a fully funded PhD scholarship supported by the Research Project Scholarship, which includes a living stipend of $37,500 per annum (tax free, 2026 rate, indexed annually) and full tuition fee coverage.
What's required
Applicants should have a strong academic record in materials science, metallurgy, or mechanical engineering, with demonstrated academic achievement and potential for scholastic success. Preferred qualifications include experience in alloy design, mechanical properties testing, X-ray diffraction, electron microscopy, and density functional theory (DFT) simulation. A working knowledge of academic research and soldering is beneficial. Applications are assessed competitively based on academic record, publication record, honours and awards, and employment history.
How to apply
Submit an expression of interest (EOI) by 19 April, 2026. Complete the 'Scholarship/Sponsorship' section with the project and scholarship details as listed. No separate application for the project or scholarship is required. For questions, contact Dr Xin Fu Tan at [email protected].
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