Postdoctoral Fellow in Computational Materials Science and Finite Element Analysis for Microelectronics Packaging George Washington University in United States

The George Washington University, in collaboration with the NIST Professional Research Experience (PREP) program, is seeking a Postdoctoral Fellow in Computational Materials Science. This position is part of the CHIPS for America initiative and focuses on advancing next-generation microelectronics packaging. The successful candidate will perform finite element analysis (FEA) to model and understand the thermo-mechanical behavior of materials at the nano- and micro-scale, directly supporting experimental work involving Atomic Force Microscopy (AFM) and Nanoindentation.

Key responsibilities include developing and refining theoretical models, simulating material behavior under thermal loads, and automating simulation workflows using Python scripting. The role also involves validating models with real-world data from AFM and instrumented indentation, with the goal of improving reliability in BEOL (Back End of Line) layers and interconnects in microelectronics.

Applicants should have a Ph.D. in Materials Science or a related field, with advanced expertise in Finite Element Methods (FEM), multiscale modeling, and nano/microscale contact mechanics. Experience with AFM and nanoindentation is required, and hands-on experimental skills are a plus. Candidates must be eligible for a Department of Commerce background check to access NIST facilities.

This is a paid postdoctoral fellowship, though specific funding details are not provided. The position offers the opportunity to work at the intersection of computational modeling and experimental validation, contributing to the reliability and advancement of microelectronics packaging technologies. Interested candidates should apply via the provided application link and ensure they meet all eligibility requirements.