Tongji University, located in Shanghai, is offering PhD and Master's positions in the College of Civil Engineering under the Shanghai Government Scholarship for the Fall 2026 semester. The university is globally recognized for its excellence in Civil Engineering, ranked No. 1 in the discipline by ARWU and U.S. News, and No. 20 by QS ranking. The research group led by Assistant Professor Sergio Reyes Arriagada is seeking passionate candidates to join ongoing and upcoming projects focused on innovative topics such as the development of low-cost seismic isolation systems using elastomeric balls, advanced constitutive modeling of elastomers for novel damping devices, damage detection systems for structures using continuous monitoring, the use of machine learning for seismic risk evaluation of infrastructure, and AI-driven autonomous drone-BIM inspection of residential façades.

The scholarship provides substantial support, including full tuition, comprehensive medical insurance, and a monthly stipend (3,000 RMB/month for master's, 3,500 RMB/month for doctoral students), with free on-campus accommodation or a housing subsidy. Applicants must be non-Chinese citizens in good health, under 35 years old for master's and under 40 for doctoral programs, and must not be applying for joint degrees or already hold another Chinese scholarship. The application process involves obtaining an acceptance letter by sending your CV, representative works, and a motivation letter to [email protected], followed by completing the online application on the university's system and selecting the Shanghai Government Scholarship Program. The deadline for applications is March 20, 2026.

This is an excellent opportunity for students interested in civil engineering, seismic isolation, elastomers, damping devices, structural monitoring, machine learning, infrastructure resilience, and AI applications in engineering. The research environment is international, collaborative, and focused on high-impact publications and innovative solutions in the field.