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Mohd Tafir Mustaffa

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1 week ago

Postdoctoral Fellowship in IC Design and RFIC Design at Universiti Sains Malaysia Universiti Sains Malaysia in Malaysia

Degree Level

Postdoc

Field of study

Biomedical Engineering

Funding

Full funding available

Deadline

December 31, 2026
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Country

Malaysia

University

Universiti Sains Malaysia (USM)

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Keywords

Biomedical Engineering
Electrical Engineering
Circuit Design
Analog Electronics
Integrated Circuit

About this position

Universiti Sains Malaysia (USM), through the Collaborative Microelectronic Design Excellence Centre (CEDEC), is inviting applications for a Post-Doctoral Fellowship (FPD) 2026 in IC design. The research focus includes analog IC design and RFIC design, with topics such as amplifiers, voltage regulators, filters, LDOs, LNA, mixers, receiver circuits, and applications for biomedical or portable devices.

This is a research-focused postdoctoral position, not a teaching role, and the work is expected to align with existing USM research fields, the supervisor’s research grant, and the 10-10 Malaysia Science, Technology, Innovation, and Economy (MySTIE) Framework. The appointment is for one year, with reappointment possible depending on KPI achievement.

Eligibility highlights: applicants must hold a PhD in a relevant field and demonstrate strong academic merit and research output over the last three years. Preferred candidates should have either two ISI Web of Science journal papers in Q1/Q2 journals, with at least one as first author, or one patent. The KPI for the appointment is to produce two first-author ISI Web of Science Q1/Q2 publications.

Funding and benefits: the fellowship offers a monthly salary/honorarium of RM 5,500, access to medical facilities within the university, mentorship and collaboration opportunities, prospects for publishing in reputable journals, and 14 days of annual leave.

Deadline: 30 April 2026. Interested candidates should contact Assoc. Prof. Dr. Mohd Tafir Mustaffa at [email protected] for more information and submit their application before the deadline.

Funding details

Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.

How to apply

Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.

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