Jihoon Seo at Clarkson University - Research Interests, Publications & Academic Profile

Jihoon Seo

Clarkson University

United States

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Research Interests

Materials Chemistry

Mineral Processing

Materials Science

Advanced Oxidation Processes

Silicon Technology

Thin Film Technology

Spark Plasma Sintering

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Articles20

Collaborators1

Panart Khajornrungruang

Associate Professor

Kyushu Institute of Technology

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Jihoon Seo

Assistant Professor

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Research Interests

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Articles20

Tailored electrostatic attraction force between anionic polymer and Si3N4 film in consecutive gate poly open CMP

Enhancing dispersion stability and recyclability of ceria slurry with polyacrylic acid for improved glass polishing performance

Detachment Energy Evaluation in Nano-Particle Cleaning Using Lateral Force Microscopy

Environmental Impact Assessment of Chemical Mechanical Planarization Consumables: Challenges, Future Needs, and Perspectives

Atomic-level insights into CeO2 performance: Chemical interactions in CMP explored through CeO2-SiO2 studies

Directing the uniform and dense Li deposition via graphene-enhanced separators for high-stability Li metal batteries

Structural dependency of pyridine carboxylic acid isomers in metal-organic coordination adsorption for copper corrosion inhibition

Comparative first-principles analysis of crystalline versus amorphous CeO2 particles: implications for chemical mechanical planarization

Development of Highly stable ceria slurry in acetic acid-ammonium acetate buffer Media for effective chemical mechanical polishing of silicon dioxide

Synergistically enhanced LiF–rich protective layer for highly stable silicon anodes

Examining Leucine As an Environmentally Friendly Corrosion Inhibitor for Cu and Co Chemical-Mechanical Planarization (CMP)

Perspective—Recent Advances and Thoughts on Ceria Particle Applications in Chemical Mechanical Planarization

Measurement of the force required to move ceria particles from SiO2 surfaces using lateral force microscopy

Suppression of Dissolution Rate via Coordination Complex in Tungsten Chemical Mechanical Planarization

Storage Temperature Effects on the Slurry Health Parameters and SiO2 Removal Rates during Chemical Mechanical Polishing

Real-Time Visualization of the Cleaning of Ceria Particles from Silicon Dioxide Films Using PVA Brush Scrubbing

Challenges and Solutions for Post-CMP Cleaning of Ceria Particles for Advanced Technology Nodes

Direct Observation of Adsorption of Ceria Particles on the Silicon Dioxide Surfaces and Their Removal

3D trajectories and diffusion of single ceria particles near a glass surface and their removal

A review on chemical and mechanical phenomena at the wafer interface during chemical mechanical planarization

Collaborators1

Panart Khajornrungruang

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