Micro/Nano Electronic Packaging and Advanced Manufacturing Masters, PhD, and Postdoc Positions at Harbin Institute of Technology (Shenzhen) Harbin Institute of Technology (Shenzhen) in China

Harbin Institute of Technology (Shenzhen) is inviting applications for Masters, PhD, and Postdoctoral positions in the field of micro/nano electronic packaging and advanced manufacturing. The research group focuses on cutting-edge topics such as lithography-free micro/nano fabrication, advanced semiconductor packaging and reliability, ultrathin 3D device integration, flexible electronics, and electrostatic printing. These areas are highly interdisciplinary, combining aspects of materials science, physics, chemistry, and mechanical engineering.

Applicants should have a strong background in Materials Sciences, Physics, Chemistry, Mechanical Engineering, or related fields. Strong English communication and academic writing skills are essential. PhD and Postdoc candidates are expected to have relevant publications. The group values motivation, collaboration, and a research-driven mindset.

Multiple scholarships are available for Master's and PhD students, including the HITSZ Entrance Scholarship (tuition waiver and stipend), Shenzhen Universiade Scholarship (CNY 35,000–40,000/year), Guangdong Government Scholarship (CNY 20,000–30,000/year), HITSZ Merit Scholarship (up to CNY 35,000–42,000/year, performance based), and the Chinese Government (CSC) Scholarship (full tuition waiver and monthly stipend: Master's CNY 3,000; PhD CNY 3,500). Postdoctoral researchers benefit from a competitive salary (≥ RMB 320,000/year), insurance, housing fund, publication/patent bonuses, Shenzhen housing subsidies or talent apartments, and additional fellowships.

To apply, interested candidates should send a detailed CV and research statement to [email protected]. This is an excellent opportunity for students and researchers interested in advanced manufacturing, micro/nano fabrication, and related fields to join a leading research group in China.