Xin Fu Tan
2 months ago
PhD in Materials Science and Mechanical Engineering: Electronic Interconnects under Extreme Thermal Cycling The University of Queensland in Australia
Degree Level
PhD
Field of study
Mechanical Engineering
Funding
Full funding availableDeadline
December 31, 2026Country
Australia
University
The University of Queensland

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About this position
The University of Queensland is offering a fully funded PhD scholarship in the School of Mechanical and Mining Engineering, focusing on the development of novel electronic interconnects for reliability under extreme thermal cycling. This research aims to create robust interconnect materials with exceptional cryogenic ductility, capable of withstanding severe temperature fluctuations without fracture, which is critical for advanced technologies in aerospace, energy, electric vehicles, and advanced manufacturing.
The project will provide the successful candidate with access to state-of-the-art facilities, including a foundry for sample fabrication, metallography and mechanical testing laboratories, electron microscopes, X-ray characterisation, and synchrotron facilities. Collaborative research opportunities are available with industry partners in Brisbane and Japan, as well as visits to national and international research facilities. Training in both specialist and transferable skills relevant to the project is included.
Applicants should have a strong background in materials science, metallurgy, or mechanical engineering, with experience in alloy design, mechanical properties testing, X-ray diffraction, electron microscopy, and DFT simulation highly desirable. The selection process is competitive and considers academic record, publication history, honours, awards, and employment experience. A working knowledge of academic research and soldering is beneficial.
The scholarship provides a living stipend of $37,500 per annum (tax free, 2026 rate, indexed annually) and covers tuition fees. The application deadline is 19 April, 2026. To apply, submit an expression of interest (EOI) including the project and scholarship details as specified in the advertisement. For further information or to discuss suitability, contact Dr Xin Fu Tan at [email protected].
Funding details
Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.
How to apply
Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.
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