Kaihang Shi
3 months ago
PhD Opening in AI/ML, Materials Science, and Chemical Engineering at University at Buffalo University at Buffalo in United States
Degree Level
PhD
Field of study
Computer Science
Funding
Full funding availableDeadline
December 31, 2026Country
United States
University
University at Buffalo

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About this position
The University at Buffalo is seeking a strong PhD candidate to join the research groups of Prof. Kaihang Shi and Prof. Jiayu Peng. The position focuses on interdisciplinary research at the intersection of artificial intelligence/machine learning (AI/ML), materials science, and chemical engineering. The successful candidate will work on computational methods aimed at accelerating scientific discovery, leveraging data science and advanced computational techniques.
This opportunity is part of UB's Computational and Data-Enabled Sciences (CDES) 3-year PhD program, which emphasizes interdisciplinary collaboration and innovative research. Applicants should already possess a Master's degree and demonstrate a keen interest in computational approaches to scientific problems. The program is designed for students excited about working across traditional boundaries in AI/ML, materials science, and chemical engineering.
Prospective students are encouraged to mention both Prof. Shi and Prof. Peng in their application materials. For more information about the CDES PhD program, visit the official program page. The application deadline for Fall 2026 is approaching, so interested candidates should act promptly. Funding details are not specified in the announcement; applicants may contact the supervisors or consult the program website for further information.
For questions or to discuss research opportunities, candidates are invited to reach out to the supervisors. This is an excellent opportunity for those passionate about computational science and interdisciplinary research in a leading US institution.
Funding details
Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.
How to apply
Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.
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