David Broniatowski
1 month ago
Postdoctoral Fellowship in Materials Science & Rheology at George Washington University/NIST George Washington University in United States
Degree Level
Postdoc
Field of study
Chemical Engineering
Funding
Full funding availableCountry
United States
University
George Washington University

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About this position
The George Washington University, in collaboration with the Materials Measurement Laboratory at NIST, is offering a postdoctoral fellowship through the NIST Professional Research Experience Program (PREP). This opportunity is focused on advancing research in materials science, with a particular emphasis on rheology, thermal analysis, and the structure–property relationships of complex polymeric and composite materials. The successful candidate will play a leading role in metrology development as part of the CHIPS initiative, translating advanced measurements into industry-relevant metrics and standards for the semiconductor and materials sectors.
Key research areas include the design and execution of rheological characterization for complex fluids and soft solids, leadership in thermal and thermomechanical characterization, and the modeling of reactive and curing systems. The position also involves building structure–property insights through multimodal characterization techniques. Applicants should have a Ph.D. in Polymer Science, Materials Science, Chemical Engineering, or a related field, with deep expertise in rheology (including orthogonal superposition and LAOS) and thermal analysis (DSC, DMA, TGA, TMA, CTE). Experience in cure kinetics, chemorheology, polymer physics, and additive manufacturing (extrusion-based and vat photopolymerization) is highly desirable. Proficiency in quantitative data processing using MATLAB, Python, Origin, or JMP is expected.
The fellowship is based on-site in Gaithersburg, MD, and requires eligibility for a U.S. Department of Commerce background check. The position is fully funded as part of the NIST PREP program, though specific stipend and funding details are not disclosed in the announcement. This is an excellent opportunity for driven researchers to lead projects and contribute to the advancement of semiconductor and materials metrology in a collaborative academic and federal research environment.
Interested candidates are encouraged to apply via the provided application link. For more information about the supervisor, Professor David Broniatowski, visit his LinkedIn profile.
Funding details
Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.
How to apply
Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.
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