Syed Muhammad Hafiz
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Graduate Research Assistantship (Master’s) in Advanced Electronics and Materials at Universiti Teknologi PETRONAS Universiti Teknologi PETRONAS in Malaysia
Degree Level
Master's
Field of study
Electrical Engineering
Funding
Full funding availableDeadline
December 31, 2026Country
Malaysia
University
Universiti Teknologi PETRONAS (UTP)

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About this position
Universiti Teknologi PETRONAS is advertising a Graduate Research Assistantship (Master’s level) for a motivated Master’s student to join a research team as a full-time, on-site Graduate Research Assistant (GRA).
The opportunity is centered on advanced electronics and materials, with a strong emphasis on bridging fundamental research and industry applications. The research focus areas highlighted in the post include printed electronics for automotive or wearable applications, advanced packaging simulation (Silvaco TCAD), and thermal interface materials (TIM) development. The role involves academic research aligned with UTP’s key focus areas, including collecting and analyzing data, preparing research reports, contributing to publications and prototypes, and participating in technology translation and commercialization activities.
This opening is suitable for candidates with backgrounds in Materials Science, Electrical Engineering, or related fields, and it explicitly mentions acceptable bachelor’s degrees in Physics, Industrial Physics, and Electrical & Electronics Engineering. Applicants should have a minimum CGPA of 3.25 or equivalent, be eligible to register as a full-time Master’s student, and be prepared for a research environment that values analytical thinking, problem-solving, communication, teamwork, and independent work.
The position offers a monthly allowance of RM 2,000. The post states an intake of September 2026 and a closing date of 31 May 2026. Interested candidates are instructed to contact Ts. Dr. Syed Muhammad Hafiz Bin Syed Mohd Jaafar and send a CV by email.
Institution: Universiti Teknologi PETRONAS. Research interests: advanced electronics, printed electronics, semiconductor packaging, thermal interface materials, simulation, and industry-linked prototype development.
Funding details
Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.
How to apply
Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.
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