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Payal Mittal

Closing soon

5 days ago

Junior Research Fellow (JRF) in Materials Science, AI, and Healthcare at Thapar Institute of Engineering and Technology Thapar Institute of Engineering and Technology in

Degree Level

PhD

Field of study

Computer Science

Funding

Full funding available

Deadline

December 31, 2026
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Country

Thapar Institute of Engineering and Technology

University

Thapar Institute of Engineering & Technology

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Keywords

Computer Science
Chemistry
Biomedical Engineering
Electrical Engineering
Chemical Engineering
Materials Science
Biotechnology
Statistical Analysis
Artificial Intelligence
Python Programming
Wearable Technology
Nanoscience
Healthcare Utilization
Physics
Smart Material
Polymer Science

About this position

Junior Research Fellow (JRF) opening at Thapar Institute of Engineering and Technology, Patiala for an ACT-sponsored interdisciplinary project titled “The Relational Interface: Adaptive AI-Driven E-Skin for Personalized Health and Social Connection”.

The project sits at the intersection of Materials Science, Artificial Intelligence, Healthcare, smart materials, and wearable technologies. The research team spans Physics, AI, Engineering, and Applied Sciences, and the selected candidate may be considered for registration in the full-time PhD programme at TIET, subject to institute norms.

Eligibility highlights: candidates with a B.E./B.Tech., M.E./M.Tech., or M.Sc. background in Biomedical Engineering, Instrumentation Engineering, Materials Science, Polymer Engineering, Chemical Engineering, Biotechnology, Physics, Chemistry, Biophysics, Biochemistry, Chemical Sciences, Nanotechnology, or allied areas may apply. A minimum of 60% marks or equivalent CGPA is required, and NET/GATE qualification is preferred or required as applicable. Desirable skills include AI/ML techniques, data analysis, and Python.

Funding: ₹35,000 per month for 24 months, extendable.

Deadline: 25 April 2026.

How to apply: send a detailed CV and scanned copies of relevant certificates/documents by email to [email protected] with CC to [email protected].

Funding details

Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.

How to apply

Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.

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