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Onur Ergen

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Openings for Masters, PhD, Postdoc, and Undergraduate Researchers in Thermal Interface Materials, AFM, and AI for Materials Discovery University of California, Berkeley in United States

Degree Level

Master's, PhD, Postdoc

Field of study

Computer Science

Funding

Full funding available
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Country

United States

University

University of California, Berkeley

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Keywords

Computer Science
Chemistry
Electrical Engineering
Materials Science
Artificial Intelligence
Quantum Materials
Thermal Transport
Atomic Force Microscopy
2d Material
Physics

About this position

Onur Ergen at the University of California, Berkeley is recruiting for research openings at multiple levels, including undergraduates, technicians, Masters students, PhD students, and postdocs.

The lab is especially interested in chemists and materials scientists working on thermal interface materials (TIMs), high thermal conductivity organic/polymeric materials, aerogels, and 2D materials. They are also looking for AFM experts with experience in AFM, KPFM, and nanoscale characterization, as well as engineers who enjoy building and improving devices. In addition, the group welcomes AI / computer science applicants with interests in LLMs, quantum materials discovery, and data analysis.

The research themes center on programming matter at the atomic level, thermal transport, organic TIMs, high-resolution scanning probe characterization, and translating discoveries into real-world applications such as batteries, electronics cooling, wearables, and semiconductors.

The post does not mention a deadline or formal application portal. Interested candidates should email [email protected] with a short note explaining their interest.

This is a recruitment post rather than a scholarship announcement, and no funding details are specified.

Funding details

Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.

How to apply

Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.

More information can be found here

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