Publisher
source

Lambèrt van Breemen

6 days ago

PhD in Simulation-integrated strategy for polymers in integrated circuit packaging Eindhoven University of Technology in Netherlands

Degree Level

PhD

Field of study

Mechanical Engineering

Funding

Full funding available

Deadline

Jun 30, 2026

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Country

Netherlands

University

Eindhoven University of Technology

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Keywords

Mechanical Engineering
Electrical Engineering
Chemical Engineering
Materials Science
Computational Physics
Rheology
Monte Carlo Simulation
Microstructure Analysis
Soft Matter Physics
Metamaterial
Physics
Integrated Circuit
Polymer Science

About this position

This PhD position focuses on developing a simulation-integrated strategy for polymers used in integrated circuit (IC) packaging, a critical area for ensuring the long-term functionality and reliability of microchips. The research is conducted jointly between the Soft Matter Rheology and Technology (SMaRT) section at KU Leuven and the Processing and Performance of Materials (P&P) section at Eindhoven University of Technology (TU/e), under the supervision of Professors Lambèrt van Breemen and Ruth Cardinaels. The project leverages both experimental and computational approaches, combining state-of-the-art facilities for rheological, microstructural, dielectric, and electromagnetic characterization with advanced numerical modeling tools.

Polymer-based IC packaging and polymer redistribution layers (PRLs) are essential for microchips, providing mechanical stability, electrical connectivity, and electromagnetic shielding. As microchips become increasingly complex and miniaturized, achieving dimensional accuracy and defect-free molding is paramount. The project addresses challenges such as warpage, delamination, and failure caused by differences in thermal expansion, processing-induced shrinkage, and mechanical stresses. The goal is to improve polymer material formulation, processing steps, and microchip design by developing a simulation-integrated toolbox. This toolbox will use experimental data to build analytical models, which are then implemented in a simulation framework for finite element-based predictions of material behavior at the microchip level. The framework will be applied to case studies focusing on mechanical robustness during thermal cycling and the integration of electromagnetic shielding in IC packaging.

The research environment is highly interdisciplinary and international, with collaboration from IMEC, a leading R&D hub in nanoelectronics. The PhD candidate will spend time at both KU Leuven and TU/e, gaining exposure to diverse research cultures and facilities. The position offers full-time employment for four years, competitive salary and benefits, and opportunities for professional development, including teaching and coaching students. The candidate will be part of a vibrant academic community in the Brainport Eindhoven region, known for its high-tech industry and innovation.

Applicants should have a master’s degree in materials science engineering, mechanical engineering, or a related field, with strong analytical skills, high grades, and a background in experimental characterization and/or numerical modeling of polymer-based materials. Fluency in English (C1 level) and motivation to work in both research groups are required. The application process involves submitting a cover letter, CV, publication list, and references online by 30 June 2026. Candidates should also apply to the corresponding KU Leuven vacancy to be considered for the joint PhD program. The position is fully funded, with additional benefits such as pension, parental leave, sports facilities, and support for international candidates.

This opportunity is ideal for candidates seeking to advance their expertise in materials science, polymer engineering, and computational modeling within a collaborative and innovative academic setting.

Funding details

Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.

How to apply

Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.

More information can be found here

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