David Broniatowski
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Post-Doctoral Fellow in Photothermal Metrology and Nanoscale Thermal Mapping George Washington University in United States
Degree Level
Postdoc
Field of study
Computer Science
Funding
Full funding availableCountry
United States
University
George Washington University

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About this position
George Washington University and NIST are recruiting a Post-Doctoral Fellow for the project “Mapping of Thermal Properties and Composition with High Throughput” in Gaithersburg, Maryland. This opportunity sits within the CHIPS Metrology Program and focuses on solving thermal bottlenecks in advanced semiconductor packaging and heterogeneous integration.
The project centers on photothermal metrology, nanoscale heat transfer, thermal modeling, and materials characterization. The selected researcher will help advance a new high-throughput photothermal microscope (~5 μs/pixel, 5 GHz bandwidth) to extract thermal conductivity, interfacial thermal conductance, and related properties from large time-domain datasets. The work also involves mapping chemical composition and thermal properties of materials and interfaces relevant to microelectronics R&D.
Responsibilities include operating the NIST photothermal microscope, developing analytical models for property extraction and uncertainty quantification, processing and fitting very large datasets (>500 GB), and designing sample geometries for high-precision thermal measurements. The role is highly research-intensive and combines experimental metrology, modeling, and data analysis.
Eligibility requirements explicitly mention a Ph.D. in Physics, Engineering, Materials Science, or Computational Mechanics. The post also asks for substantial experience in thermal/photothermal metrology, thermal modeling, time-domain trace fitting, and large-scale or multivariate data analysis.
This is a postdoctoral opening; the post does not specify salary, stipend, or deadline. Interested applicants should use the provided application link and follow the instructions in the posting.
Funding details
Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.
How to apply
Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.
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