Post-Doctoral Fellow in Semiconductor Reliability Testing and Failure Analysis George Washington University in United States

George Washington University and NIST are seeking a Post-Doctoral Fellow in semiconductor reliability testing and failure analysis at the NIST campus in Gaithersburg, Maryland. This opportunity is tied to the CHIPS Act and focuses on improving the long-term reliability of advanced microelectronics and semiconductor packages under environmental stress.

The research centers on how aging and property degradation occur in complex package architectures, with special attention to polymeric thin films and multilayer interfaces. The fellow will develop new methods for measuring multilayer adhesion, perform in-situ environmental digital image correlation (DIC) during thermal cycling, and use microscopy and X-ray-based techniques for advanced failure analysis. The role also includes finite element analysis (FEA) to model warpage and thermo-mechanical loading, plus data generation for reliability prediction frameworks.

Applicants should hold a Ph.D. in Materials Science, Mechanical Engineering, Physics, or Chemical Engineering. A strong background in polymeric thin film adhesion and structure-property relationships is required, along with experience in mechanical characterization, thermal cycling, and advanced failure analysis. Prior experience in advanced semiconductor packaging is highly preferred.

This is a research-intensive postdoctoral position with high impact for industry-wide quality assurance and material selection in microelectronics. The post does not specify stipend, salary, or deadline details. Interested candidates should apply through the provided application link.