David Broniatowski
6 months ago
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Post-Doctoral Fellow in Semiconductor Reliability Testing and Failure Analysis George Washington University in United States
Degree Level
Postdoc
Field of study
Mechanical Engineering
Funding
Post-doctoral fellow position associated with George Washington University and NIST in response to CHIPS Act needs; funding details such as stipend or salary are not specified in the post.
Deadline
Expired
Country
United States
University
George Washington University
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About this position
George Washington University and NIST are seeking a Post-Doctoral Fellow in semiconductor reliability testing and failure analysis at the NIST campus in Gaithersburg, Maryland. This opportunity is tied to the CHIPS Act and focuses on improving the long-term reliability of advanced microelectronics and semiconductor packages under environmental stress.
The research centers on how aging and property degradation occur in complex package architectures, with special attention to polymeric thin films and multilayer interfaces. The fellow will develop new methods for measuring multilayer adhesion, perform in-situ environmental digital image correlation (DIC) during thermal cycling, and use microscopy and X-ray-based techniques for advanced failure analysis. The role also includes finite element analysis (FEA) to model warpage and thermo-mechanical loading, plus data generation for reliability prediction frameworks.
Applicants should hold a Ph.D. in Materials Science, Mechanical Engineering, Physics, or Chemical Engineering. A strong background in polymeric thin film adhesion and structure-property relationships is required, along with experience in mechanical characterization, thermal cycling, and advanced failure analysis. Prior experience in advanced semiconductor packaging is highly preferred.
This is a research-intensive postdoctoral position with high impact for industry-wide quality assurance and material selection in microelectronics. The post does not specify stipend, salary, or deadline details. Interested candidates should apply through the provided application link.
Funding details
Post-doctoral fellow position associated with George Washington University and NIST in response to CHIPS Act needs; funding details such as stipend or salary are not specified in the post.
What's required
Ph.D. in Materials Science, Mechanical Engineering, Physics, or ChemE. Strong background in polymeric thin film adhesion and structure-property relationships. Experience with mechanical characterization, thermal cycling, and advanced failure analysis is required. Prior experience in advanced semiconductor packaging is highly preferred.
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Professors
Professor of Engineering Management and Systems Engineering
United States
Research Interests
Artificial Intelligence
Statistics
Physics
Materials Science
Computer Science
Make your next move.
Prepare your application
Review drafts and confirm requirements with the university.