Rahamatullah Khondoker
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Postdoc research visit in Cybersecurity and Digitalization (TWAS-DFG Cooperation Visits Programme) Technische Hochschule Mittelhessen in Germany
Degree Level
Postdoc
Field of study
Computer Science
Funding
Full funding availableDeadline
December 31, 2026Country
Germany
University
University of Applied Sciences Mittelhessen

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About this position
Technische Hochschule Mittelhessen’s CYSECDIGITAL research group, led by Prof. Dr. Rahamatullah Khondoker, is hosting applications under the TWAS-DFG Cooperation Visits Programme for postdoctoral researchers from selected MENA countries. The opportunity is aimed at researchers in cybersecurity, IT security, automotive security, and related digitalization topics, with the group’s broader interests spanning smart city, smart industry, autonomous mobility, and smart healthcare.
The visit is for 3 months in Germany and is intended for research cooperation with the host institution. The DFG funding supports the host institution rather than paying a standard salary to the visitor: up to €2,350/month for accommodation and visa expenses, up to €1,350 for flight and rail travel, and up to €700/month for direct project costs such as materials and laboratory expenses.
Eligibility highlights: applicants must hold a research position at an institution in Algeria, Egypt, Iraq, Jordan, Lebanon, Libya, Morocco, Oman, Palestine, Syria, Tunisia, or Yemen; have at least five years of engagement in science/research/teaching in one of those countries or a sub-Saharan African country; and not have obtained the doctorate before 2021 (with a special extension for visiting female researchers with children). Applicants must not already have an established collaboration with the intended host.
Deadline: 15 April 2026. The proposal must be submitted to TWAS by the visiting researcher and include an official invitation letter from the host describing the research topic and available infrastructure. Interested applicants should contact the host, align on a cooperation topic, and then prepare the invitation letter and proposal materials.
Funding details
Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.
How to apply
Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.
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