Postdoctoral Fellow in Mechanical Testing and Reliability Modeling for Next-Gen AI Chips National Institute of Standards and Technology in United States

George Washington University and the National Institute of Standards and Technology (NIST) are seeking a Post-Doctoral Fellow for research on the structural integrity of next-generation AI chips and advanced semiconductor packaging. The project focuses on modeling and mechanical testing of heterogeneous structures in the context of the CHIPS Act mission, with an emphasis on reliability and failure analysis for 3D-stacked and multilayer systems.

The successful candidate will lead reliability modeling efforts using finite element analysis (FEA) and advanced mechanical testing to predict how heterogeneous multilayered systems made of polymers, metals, and silicon behave over their service lifetime. Research topics include thermomechanical modeling, nano/micro-scale testing, adhesion testing, polymer degradation, damage modeling, and investigation of failure mechanisms such as delamination and cohesive damage.

Applicants should hold a Ph.D. in Mechanical Engineering, Physics, Materials Science, or a related field. Strong expertise in FEA of heterogeneous systems is required, together with hands-on experience in nano- and micro-scale mechanical testing. Familiarity with adhesion testing, polymer degradation, and damage propagation is also expected. The post notes that the candidate must currently live in the United States.

This is a research-intensive postdoctoral opportunity based at the NIST Campus in Gaithersburg, Maryland, supporting the scientific basis for quality assurance in the U.S. semiconductor supply chain. Interested applicants should use the provided application link to review the posting and submit their materials.