Raghavan Nagarajan
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Singapore Ministry of Education Scholarship
Master of Engineering (Interdisciplinary) Research Program in Robotics, Semiconductors, Biomedical Technologies, and Energy & Sustainability at Singapore University of Technology and Design Singapore University of Technology and Design in Singapore
Degree Level
Master's
Field of study
Computer Science
Funding
Full funding availableDeadline
December 31, 2026Country
Singapore
University
Singapore University of Technology and Design

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About this position
Applications are open for the Master of Engineering (Interdisciplinary) Research Program at the Singapore University of Technology and Design (SUTD), specifically within the Engineering Product Development (EPD) pillar.
This is a research-oriented master’s opportunity for applicants interested in interdisciplinary engineering work that crosses traditional boundaries. The programme highlights research themes including robotics & automation, semiconductors, IC design & photonics, design science & engineering, biomedical & healthcare technologies, and energy & sustainability. The post also emphasizes work at the intersection of these areas with Design.AI.
The programme is described as a fully sponsored 2-year full-time research programme funded by Singapore’s Ministry of Education (MOE). It offers bond-free scholarship support for Singapore Citizens, Permanent Residents, and international students, with a monthly stipend of approximately S$3,100–S$3,800.
Students may work on academic, industrial, or industry-collaborative research projects and will be supervised by SUTD faculty members. The programme page notes that MEng students conduct research under a faculty supervisor and complete a thesis, along with professional development and technical courses.
The application deadline is 30 June 2026, and the programme commencement is September 2026. Interested applicants are encouraged to review the programme website, browse EPD faculty profiles, and contact faculty members whose research aligns with their interests before applying.
Relevant study areas include electrical engineering, robotics, computer science, biomedical engineering, materials science, mechanical engineering, physics, and environmental science.
Funding details
Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.
How to apply
Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.
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