Up to 30% off — ends 2 Aug
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Up to 30% off — ends 2 Aug
ONLY00h00m00s
David Broniatowski
1 month ago
Post-Doctoral Fellow in Thermal 3D Magnetic Imaging of Advanced Semiconductor Packages National Institute of Standards and Technology in United States
Degree Level
Postdoc
Field of study
Computer Science
Funding
Full funding availableCountry
United States
University
National Institute of Standards and Technology

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About this position
George Washington University and the National Institute of Standards and Technology (NIST) are recruiting a Post-Doctoral Fellow for Thermal 3D Magnetic Imaging of Advanced Semiconductor Packages through the NIST Professional Research Experience Program (PREP).
This opportunity focuses on Magnetic Particle Imaging (MPI) for non-invasive thermal mapping inside vertically stacked semiconductor packages, where conventional infrared or optical tools cannot access internal hotspots. The project combines physics, materials science, electrical engineering, and computer science in a highly interdisciplinary research environment.
The successful candidate will help design and build custom high-sensitivity magnetic microscopes, develop sensor and electronics hardware, create digital acquisition controls, and write Python-based image reconstruction and visualization software. The role also includes machine-learning-driven thermal classification, automation scripts for nanoparticle tracer synthesis profiles, and experimental work on packaged semiconductor test devices.
Eligibility highlights include a Ph.D. in Physics, Physical Chemistry, Materials Science, Engineering, or a closely related field, plus 3 years of relevant research experience. Applicants should have hands-on experience with custom electronic, magnetic, or optical instrumentation and familiarity with CAD tools such as SolidWorks or Autodesk Inventor. Strong programming skills in Python, MATLAB, or LabVIEW are important.
The post is based at the NIST campus in Gaithersburg, Maryland, United States. No deadline, stipend, or salary details are stated in the post. Interested candidates should use the application link provided and review the role requirements before submitting.
Funding details
Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.
How to apply
Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.
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