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Dmitry Kireev

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2 days ago

Postdoc Opportunity in Biosensors, Devices, Circuits, and CMOS at University of Massachusetts Amherst University of Massachusetts Amherst in United States

Degree Level

Postdoc

Field of study

Biomedical Engineering

Funding

Full funding available
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Country

United States

University

University of Massachusetts Amherst

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Keywords

Biomedical Engineering
Electrical Engineering
Materials Science
Bioelectronics
Food Packaging
Neuroengineering
Biosensor
Nanoelectronic
2d Material
Physics

About this position

Postdoctoral opportunity in biosensors, devices, circuits, and CMOS at the University of Massachusetts Amherst.

This post advertises an immediate postdoc opening in a collaborative research project involving the University of Massachusetts Amherst, New York University, the University of Connecticut, Caltech, and others. The research areas highlighted include biosensors, devices, circuits, CMOS, cleanroom fabrication, data acquisition, I/O, packaging, and broader themes in bioelectronics, nanoelectronics, 2D materials, biohybrids, and neuroengineering.

The announcer is Dmitry Kireev, an Assistant Professor at the University of Massachusetts Amherst. The post is framed as a recruiting message for a postdoctoral researcher, and the contact email provided is [email protected].

Eligibility highlights: applicants should hold a PhD in physics, electrical engineering, or a related field. Strong expertise in biosensors, devices, circuits, CMOS, cleanroom processes, fabrication, data acquisition, I/O, and packaging is requested. There is also a funding-related restriction: due to the funder's limitations, the candidate must be a US citizen or already in the US with eligible status (for example J-1, H-1b, or green card).

Timing: the position is available immediately, with a start date listed as ASAP / September 1, 2026.

How to apply: email Dmitry Kireev directly at [email protected] with your CV and a brief summary of your relevant experience. Mention your background in biosensors, CMOS, fabrication, and related device work.

Funding details

Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.

How to apply

Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.

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