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1 month ago

Postdoctoral Associate in Seed Biology, Seed Technology, Plant Pathology, and Entomology at Cornell AgriTech Cornell University in United States

Degree Level

Postdoc

Field of study

Chemistry

Funding

Full funding available

Deadline

Expired

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Country

United States

University

Cornell University

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Keywords

Chemistry
Environmental Science
Agriculture
Horticulture
Materials Science
Biology
Entomology
Plant Pathology
Crop Science
Seed Science
Nanoscience
Pest Management

About this position

Cornell AgriTech (Cornell University) is advertising a Postdoctoral Associate position in the Seed Biology & Technology Program within the Section of Horticulture in Geneva, New York.

The project sits at the intersection of seed biology, seed technology, plant pathology, entomology, integrated pest management, horticulture, materials science, and nanotechnology. The research focuses on seed-applied, non-neonicotinoid protection strategies for early-season crop pests, including Delia spp., and on evaluating seed coating integrity, delivery characteristics of plant defense signaling compounds, and interactions with seed pathogens under cold soil conditions.

The postdoctoral associate will conduct laboratory, greenhouse, controlled-environment, and field experiments, contribute to seed coating formulation and treatment evaluation, analyze data, prepare manuscripts and reports, and help mentor undergraduate assistants. The role also includes stakeholder engagement and extension-related activities.

Eligibility highlights: a Ph.D. in Seed Science, Crop Science, Plant Pathology, Plant Physiology, Entomology, or a related field; experience in seed biology, seed pathology, seed treatment technologies, or plant–insect/plant–microbe interactions; strong experimental design and data analysis skills; excellent communication; and the ability to work independently and collaboratively. A valid unrestricted NYS driver’s license is required.

Funding: this is a paid postdoctoral appointment with a hiring rate of $63,480.

Application: apply through Academic Jobs Online by 2026-06-30. Submit a cover letter, CV, and three references. The position is reviewed on a rolling basis until filled.

Funding details

Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.

How to apply

Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.

More information can be found here

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