The Hong Kong Polytechnic University
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Postdoctoral Fellow in Intelligent Ultra-Precision Air-Bearing Hydrostatic Spindle for Grinding Semiconductor Wafer Hong Kong Polytechnic University in Hong Kong
Degree Level
Postdoc
Field of study
Mechanical Engineering
Funding
A highly competitive remuneration package will be offered. The appointment period is eight months for each of the three posts.
Deadline
Feb 27, 2027
Country
Hong Kong
University
The Hong Kong Polytechnic University

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About this position
Hong Kong Polytechnic University is recruiting three Postdoctoral Fellows in the Department of Industrial and Systems Engineering for a project on development of an intelligent ultra-precision air-bearing hydrostatic spindle for grinding semiconductor wafer.
The appointment period is eight months for each post. The role is research-focused and supports the project leader in advanced manufacturing and precision engineering work related to semiconductor wafer grinding.
Eligibility: Applicants should hold a doctoral degree or an equivalent qualification and have no more than five years of post-qualification experience at the time of application.
Funding: A highly competitive remuneration package will be offered.
Supervision/contact: Applicants may contact Prof. Wai Sze Yip at [email protected] for further information.
Deadline: 27 February 2027.
Apply via: the Hong Kong Polytechnic University job portal.
Funding details
A highly competitive remuneration package will be offered. The appointment period is eight months for each of the three posts.
What's required
Applicants should have a doctoral degree or an equivalent qualification and must have no more than five years of post-qualification experience at the time of application.
How to apply
Apply through the Hong Kong Polytechnic University job portal using the provided application link. Applicants may contact Prof. Wai Sze Yip by phone or email for further information.
More information can be found here
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