Postdoctoral Research Fellow in Advanced Microelectronics Packaging and Heterogeneous Integration Tampere University in

Tampere University is recruiting a Postdoctoral Research Fellow in Advanced Microelectronics Packaging. The position is centered on next-generation semiconductor packaging and heterogeneous integration, with research topics including 2D/2.5D/3D integration, chip-to-wafer and chip-to-chip technologies, electronics–photonics co-packaging, WBG integration (GaN/SiC), reliability, thermal interfaces, and advanced packaging methods.

The role is based in a strong research environment and makes use of SiPFAB as a key infrastructure platform for System-in-Package (SiP) research and packaging process development. This is a 4-year, full-time postdoctoral opening, suitable for candidates with a background in microelectronics packaging, semiconductor device integration, or closely related electrical engineering/materials research.

Institution: Tampere University, Finland.

Application deadline: 11 May 2026, 23:59 EEST.

Interested applicants should apply via the recruitment link and review the vacancy page for full details on required documents and submission steps.