Jukka Viheriälä

Tampere University is recruiting a Postdoctoral Research Fellow in Advanced Microelectronics Packaging . The position is centered on next-generation semiconductor packaging and heterogeneous integration , with research topics including 2D/2.5D/3D integration , chip-to-wafer and chip-to-chip technologies, electronics–photonics co-packaging , WBG integration (GaN/SiC), reliability , thermal interfaces , and advanced packaging methods. The role is based in a strong research environment and makes use of SiPFAB as a key infrastructure platform for System-in-Package (SiP) research and packaging process development. This is a 4-year, full-time postdoctoral opening, suitable for candidates with a background in microelectronics packaging, semiconductor device integration, or closely related electrical engineering/materials research. Institution: Tampere University, Finland. Application deadline: 11 May 2026, 23:59 EEST. Interested applicants should apply via the recruitment link and review the vacancy page for full details on required documents and submission steps.