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source

Chuo University

Postdoctoral Researcher Opening in Bio-3D Printing, Microfluidics, and Microrobotics Chuo University in Japan

Degree Level

Postdoc

Field of study

Biomedical Engineering

Funding

Full funding available

Deadline

Sep 30, 2026

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Country

Japan

University

Chuo University

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Keywords

Biomedical Engineering
Mechanical Engineering
Materials Science
Biology
Bioprinting
Robotics
Microfluidic
Microrobotics

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About this position

Chuo University’s Hayakawa Laboratory in the Department of Precision Mechanical Engineering is recruiting a project-based fixed-term researcher for interdisciplinary work at the intersection of biomedical engineering, materials science, mechanical engineering, and robotics.

The position is part of the Cabinet Office Moonshot Program Yamanishi Project, focused on evaluating enhanced and expanded cells (“avatar cells”) and developing three-dimensional biomimetic models that simulate the in-vivo environment. The work uses bio-3D printers, microfluidic devices, and related microrobot systems to support cell manipulation and analysis.

This is a full-time, fixed-term researcher role with an annual salary of 4 million to 6 million yen. The contract is renewed annually for up to five years, with the current appointment running until March 31, 2027 and possible renewal depending on project continuation and mutual agreement.

Applicants should hold a doctoral degree from a science and engineering university. Experience in mechanical engineering, biology, biomedical engineering, or biomaterials is welcomed, and candidates from other fields who are eager to learn microfluidics and microrobotics are also encouraged.

The workplace is Korakuen Campus, Bunkyo-ku, Tokyo, Japan. Applications are accepted from August 19, 2026 to September 30, 2026, and may close earlier once a suitable candidate is selected.

To apply, prepare a resume and list of achievements in electronic/free format and submit them via the JREC-IN Portal or by email to [email protected].

Funding details

Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.

How to apply

Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.

More information can be found here

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