Publisher
source

University of California, Los Angeles

Top university

Postdoctoral Scholar in Microfluidic Radiolabeling and Radiochemistry at UCLA University of California, Los Angeles in United States

Degree Level

Postdoc

Field of study

Biomedical Engineering

Funding

Full funding available

Deadline

Sep 30, 2026

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Country

United States

University

University of California, Los Angeles

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Keywords

Biomedical Engineering
Mechanical Engineering
Chemical Engineering
Materials Science
Biology
Radiochemistry
Medical Science
Microfluidic
Physics
bio engineering

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About this position

Postdoctoral Scholar opportunity at the University of California, Los Angeles (UCLA) in the van Dam Lab at the Crump Institute for Molecular Imaging.

The lab is recruiting a postdoc for a multidisciplinary research program centered on microfluidic devices, radiolabeling, high-throughput radioassays, and analytical radiochemistry. The project specifically aims to develop a novel high-sensitivity measurement technology to assess radiotracer uptake in biological cells, with applications in disease biology, drug discovery, and nuclear medicine.

Ideal background: a Ph.D. in mechanical engineering, bioengineering, or a closely related field, with emphasis on microfluidic device physics, design, fabrication, and applications. Required experience includes fluidic circuit design and CAD, microfabrication, prototyping, and characterization of microfluidic devices and systems. Helpful experience includes PDMS microfluidics, microfluidic process engineering, automation of microfluidic assays, mammalian cell work, and radiolabeled compounds.

Funding: paid postdoctoral scholar appointment with a salary range of $69,073 to $82,836.

Application materials: CV, cover letter, statement of research, reference check authorization release form, and contact information for 3 references.

Deadline: applications are reviewed starting Aug 31, 2026, with a final deadline of Sep 30, 2026.

Location: Los Angeles, California, United States.

Funding details

Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.

How to apply

Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.

More information can be found here

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