Osaka Institute of Technology
4 days ago
Research Staff Position in Metallurgy and Materials Processing at Osaka Institute of Industrial Technology Osaka Institute of Industrial Technology in Japan
Degree Level
Postdoc
Field of study
Mechanical Engineering
Funding
Full funding availableDeadline
Oct 14, 2026
Country
Japan
University
Osaka Institute of Technology

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About this position
Osaka Institute of Industrial Technology is recruiting a full-time research staff member in metallurgy and related materials science areas. The position is based in the Kinki region, specifically Osaka Prefecture, Japan, at the institute’s facility in Izumi City.
The research themes include material processing, microstructure control, structural and functional materials, metallic material properties, inorganic materials, and materials mechanics. The posting also highlights technologies related to metal additive manufacturing (AM / 3D printing), metal structure and property control, bonding, fracture, and microstructure analysis.
This is a permanent, full-time position with no fixed term and no tenure track. The salary is stated as annual income from about 6 million yen, with pay determined by academic background, licenses, and work experience. Allowances may include commuting, family, housing, overtime, end-of-term bonus, diligence bonus, and retirement allowance, subject to conditions.
Eligibility includes candidates with a Ph.D., master’s degree, or bachelor’s degree. The notice also specifies an age condition and requires graduation/completion from a university, graduate school, or equivalent institution, including expected completion by March 2027.
Applications must be submitted during the stated window, August 10, 2026 to October 14, 2026. Applicants should prepare the prescribed electronic documents, including a resume, list of achievements, and relevant certificates/transcripts. Submission is via the recruitment agency website; email and JREC-IN portal web application are not available.
Funding details
Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.
How to apply
Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.
More information can be found here
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