Publisher
source

Mahdi Nikdast

2 months ago

Two Postdoctoral Researcher Positions in ROIC Design and Optical Modulation at Colorado State University Colorado State University in United States

Degree Level

Postdoc

Field of study

Computer Science

Funding

Postdoctoral appointments are initially for 1 year and may be extended to 2–3 years based on performance, project needs, and funding availability. Salary is $85,000–$95,000 per year depending on experience and qualifications.

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Country

United States

University

Colorado State University

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Keywords

Computer Science
Electrical Engineering
Silicon Photonics
Analog Electronics
Physics

About this position

Colorado State University’s Electronic-Photonic System Co-Design Lab is recruiting two postdoctoral researchers in electrical engineering with a strong focus on ROIC design, mixed-signal IC design, optical modulation, silicon photonics, photonic interfaces, and electronic-photonic system co-design.

Position 1 centers on ROIC and mixed-signal IC design, including sensor interfaces, low-noise front ends, ADCs/DACs, drivers, timing/control circuits, readout architectures, CMOS layout/verification, parasitic extraction, post-layout simulation, and tape-out work. Experience with Cadence Virtuoso, Spectre, HSPICE, Calibre, and related IC design tools is relevant, and hands-on tape-out experience is required.

Position 2 focuses on optical modulation, photonic interfaces, and system co-design. Relevant topics include silicon photonics, modulators, photodetectors, lasers, photonic links, optical testing, electronic-photonic co-design, and interfaces between ROICs, drivers, and modulators. Tools such as Lumerical, COMSOL, Synopsys, Cadence, KLayout, and IPKISS are mentioned, and tape-out experience in photonic, electronic, or electronic-photonic ICs is strongly preferred.

The positions involve research, simulation, verification, IC/PIC tape-outs, architecture development for intelligent sensor readout and near-sensor processing, technical reporting, presentations, collaboration, publication support, proposal work, and student mentoring.

These are postdoctoral appointments, initially for 1 year and potentially extendable to 2–3 years depending on performance, project needs, and funding availability. The salary is $85,000–$95,000 per year, depending on experience and qualifications.

Eligibility note: applicants must be U.S. residents with active authorization to work in the United States, including U.S. citizens, U.S. permanent residents/green card holders, or individuals with active U.S. work authorization.

How to apply: send a CV, cover letter, and names of references to [email protected] with the subject line “ROIC Postdoc: Your Name.” Applications are reviewed on a rolling basis until the positions are filled.

Funding details

Postdoctoral appointments are initially for 1 year and may be extended to 2–3 years based on performance, project needs, and funding availability. Salary is $85,000–$95,000 per year depending on experience and qualifications.

What's required

Applicants must be U.S. residents with active authorization to work in the United States, including U.S. citizens, U.S. permanent residents/green card holders, or individuals with active U.S. work authorization. Position 1 requires experience in analog/mixed-signal and/or ROIC design, sensor interfaces, low-noise front ends, ADCs/DACs, drivers, timing/control circuits, or readout architectures, plus CMOS IC design, layout, verification, parasitic extraction, post-layout simulation, and Cadence Virtuoso, Spectre, HSPICE, Calibre, or similar tools; hands-on tape-out experience is required. Position 2 requires experience in silicon photonics, optical modulation, PICs, or optoelectronic interfaces, with knowledge of modulators, photodetectors, lasers, photonic links, optical testing, electronic-photonic co-design, and tools such as Lumerical, COMSOL, Synopsys, Cadence, KLayout, or IPKISS; tape-out experience is strongly preferred. Additional strengths include cryogenic, low-power, radiation-tolerant, high-speed, packaging, high-speed measurement, near-sensor processing, event-based sensing, or low-power edge processing experience.

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