Postdoctoral Research Associate in Advanced TEM and In Situ Electron Microscopy
University of Illinois Chicago (UIC) is recruiting a
Postdoctoral Research Associate
for a newly funded project in
advanced TEM
and
in situ / operando electron microscopy
. The work is based in Tolou Shokuhfar’s Biomedical Engineering laboratory and involves close collaboration with Prof. Reza Shahbazian-Yassar’s group at UIC.
The research centers on
advanced materials characterization
,
nanoscale interfaces
, and mechanistic studies of
nanomaterials
,
biomaterials
,
electrochemistry
, and nanoscale materials transformations. The successful candidate will use high-level TEM/STEM methods, including high-resolution imaging, electron diffraction, STEM-EDS and/or EELS, and may work on in situ or operando TEM, liquid-cell, electrochemical, environmental, or gas-cell experiments.
This is a highly specialized role for someone with substantial independent microscopy experience. The post explicitly states that it is
not an entry-level TEM training position
. Competitive applicants should already have strong hands-on TEM/STEM expertise, the ability to design and troubleshoot experiments independently, and a publication record showing advanced microscopy contributions.
Required background:
PhD in Materials Science, Mechanical Engineering, Physics, Chemistry, Chemical Engineering, Biomedical Engineering, or a related field. Additional strengths include crystallography, interfaces, defects, phase transformations, structure-property relationships, quantitative image analysis, FIB/TEM specimen preparation, and experience with beam-sensitive materials.
Funding:
The position is part of a newly funded research program. No salary or stipend amount is listed in the post.
How to apply:
Email both
[email protected]
and
[email protected]
with a CV, brief cover letter, 2–3 representative first-author publications, and contact details for three references. Use the subject line provided in the post. Applications are reviewed on a rolling basis until the position is filled.