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Chalmers University of Technology

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Fully Funded PhD in Thermal Packaging for RF and mmWave Communication & Sensor Systems Chalmers University of Technology in Sweden

Degree Level

PhD

Field of study

Mechanical Engineering

Funding

Full funding available

Deadline

Jul 31, 2026

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Country

Sweden

University

Chalmers University of Technology

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Keywords

Mechanical Engineering
Electrical Engineering
Materials Science
Wireless Communication
Additive Manufacturing
Physics
Electronics

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About this position

Chalmers University of Technology is advertising a fully funded PhD position in Thermal Packaging Solutions for Future Communication & Sensor Systems in Sweden. The position is hosted in the Microwave Electronics Laboratory and focuses on research at the intersection of electrical engineering, materials science, mechanical engineering, and physics.

The project covers thermal packaging for RF and mmWave systems, GaN-based high-frequency electronics, RF/radar/wireless communication systems, semiconductor packaging, thermal management, and additive manufacturing with multiphysics design. It is a strong fit for candidates interested in microwave electronics, high-frequency devices, and advanced packaging for next-generation communication and sensing technologies.

The post states that the PhD is fully funded and includes a salary of 35,725 SEK per month. Students will also have access to advanced nanofabrication and RF measurement facilities within an international research environment in Sweden.

Eligibility highlights include a Master’s degree in Electrical, Mechanical, Materials Engineering, Engineering Physics, or a related field. Experience with COMSOL, ANSYS, MATLAB, or Python is considered an advantage, and prior background in RF, microwave, thermal engineering, or semiconductor technologies is preferred.

To apply, prepare a CV, personal letter, transcripts, and your bachelor’s and master’s thesis documents, then submit your application through the Chalmers job link before the deadline.

Deadline: 31 July 2026.

Funding details

Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.

How to apply

Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.

More information can be found here

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