Eric Neiva
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Master’s, PhD and Postdoctoral Positions in Multiscale Modelling of Atherosclerosis and Environmental Factors Universitat Politècnica de Catalunya in Spain
Degree Level
Master's, PhD, Postdoc
Field of study
Computer Science
Funding
Full funding availableDeadline
Sep 30, 2026
Country
Spain
University
Universitat Politècnica de Catalunya

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About this position
Call for expressions of interest for the ADHERE project at Universitat Politècnica de Catalunya (UPC), Barcelona.
The project focuses on multiscale modelling of atherosclerosis progression driven by environmental factors, combining computational mathematics, fluid mechanics, biomedical engineering, and collaboration with experimentalists and clinicians. The research aims to develop next-generation computational methods to study how environmental factors influence plaque formation, growth, and cardiovascular risk in realistic vascular geometries.
Openings are available for Master’s, PhD, and postdoctoral researchers. The work includes multiscale mathematical modelling of atherosclerotic plaque formation and growth, structure-preserving computational methods for multiphysics problems with moving interfaces, high-fidelity simulations of transport phenomena and biological processes, and integration of computational models with experimental observations and patient-specific clinical data.
Ideal candidates have a background in engineering, physics, or mathematics, with interest or experience in fluid mechanics, mathematical modelling, scientific computing, and programming tools such as Julia, Python, C++, and HPC libraries. The project emphasizes interdisciplinary research, advanced modelling, and high-performance computing in a supportive environment with career development opportunities.
Funding is provided through the Spanish State Research Agency (AEI). The post does not list stipend or salary details. Applications are due by 2026-09-30.
To apply, send a CV and cover letter to [email protected]. Master’s and PhD applicants should also include academic transcripts.
Funding details
Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.
How to apply
Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.
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