PhD and Postdoctoral Opportunities in Advanced Microelectronic Packaging, FOWLP, and Thermal Management at Université de Sherbrooke Université de Sherbrooke in Canada

Université de Sherbrooke and IBM are advertising three postdoctoral opportunities and related PhD-level research projects in advanced microelectronic packaging, with a strong focus on Fan-Out Wafer-Level Packaging (FOWLP), heterogeneous integration, microfabrication, and thermal management.

The projects are hosted in the INPAQT ecosystem and carried out mainly at the Interdisciplinary Institute for Technological Innovation (3IT) and the MiQro Innovation Collaborative Center (C2MI) in Bromont, Canada, in collaboration with IBM Canada. The research environment is described as highly applied, with state-of-the-art infrastructure and direct industrial collaboration.

Postdoc 1 focuses on an integrated vapor chamber cooling system for high-density FOWLP. The work includes thermal resistance modeling, thermomechanical and fluidic simulation, vapor chamber fabrication using microfabrication techniques such as Si etching and gold-gold bonding, thermal characterization, and integration into an advanced packaging test vehicle.

Postdoc 2 focuses on optimization of microfabrication processes for micropillars in FOWLP. The project targets ultra-fine pitch Cu/Ag/Sn micropillars, lithography and alignment, electroplating optimization, thermocompression bonding conditions, and morphological characterization for high-density vertical interconnections.

Postdoc 3 focuses on temporary bonding and debonding processes for FOWLP. The successful candidate will develop temporary carrier and release-tape processes, study material properties and process conditions, and validate integrity after chip interconnection in close collaboration with IBM engineers.

The PhD-related project pages also indicate research opportunities in mechanical engineering and electrical engineering, with funding offered at $25,000 CAD per year. The postdoctoral project lists $50,000 annually. The work is part of an IBM/NSERC Alliance Project on multi-chip heterogeneous integration for high-performance computing.

Eligibility highlights include a master’s degree for the PhD projects or a PhD for the postdoc, plus experience or strong interest in clean-room work, microfabrication, thermal modeling, packaging, and experimental characterization. English or French communication skills are required. Application materials mentioned include a cover letter, CV, transcripts, and references or recommendation letters depending on the project.

Application timing in the post points to a September 2025 start date, and the linked project pages were updated in late 2025 and March 2026. Interested candidates should use the Université de Sherbrooke project portal and the contact emails provided to express interest and submit the requested documents.