Dominique Drouin

Université de Sherbrooke and IBM are advertising three postdoctoral opportunities and related PhD-level research projects in advanced microelectronic packaging , with a strong focus on Fan-Out Wafer-Level Packaging (FOWLP) , heterogeneous integration , microfabrication , and thermal management . The projects are hosted in the INPAQT ecosystem and carried out mainly at the Interdisciplinary Institute for Technological Innovation (3IT) and the MiQro Innovation Collaborative Center (C2MI) in Bromont, Canada, in collaboration with IBM Canada . The research environment is described as highly applied, with state-of-the-art infrastructure and direct industrial collaboration. Postdoc 1 focuses on an integrated vapor chamber cooling system for high-density FOWLP. The work includes thermal resistance modeling, thermomechanical and fluidic simulation, vapor chamber fabrication using microfabrication techniques such as Si etching and gold-gold bonding, thermal characterization, and integration into an advanced packaging test vehicle. Postdoc 2 focuses on optimization of microfabrication processes for micropillars in FOWLP. The project targets ultra-fine pitch Cu/Ag/Sn micropillars, lithography and alignment, electroplating optimization, thermocompression bonding conditions, and morphological characterization for high-density vertical interconnections. Postdoc 3 focuses on temporary bonding and debonding processes for FOWLP. The successful candidate will develop temporary carrier and release-tape processes, study material properties and process conditions, and validate integrity after chip interconnection in close collaboration with IBM engineers. The PhD-related project pages also indicate research opportunities in mechanical engineering and electrical engineering , with funding offered at $25,000 CAD per year . The postdoctoral project lists $50,000 annually . The work is part of an IBM/NSERC Alliance Project on multi-chip heterogeneous integration for high-performance computing. Eligibility highlights include a master’s degree for the PhD projects or a PhD for the postdoc, plus experience or strong interest in clean-room work, microfabrication, thermal modeling, packaging, and experimental characterization. English or French communication skills are required. Application materials mentioned include a cover letter, CV, transcripts, and references or recommendation letters depending on the project. Application timing in the post points to a September 2025 start date, and the linked project pages were updated in late 2025 and March 2026. Interested candidates should use the Université de Sherbrooke project portal and the contact emails provided to express interest and submit the requested documents.

PhD opportunity at the Université de Sherbrooke in Canada, focused on the optimization of a micropillar microfabrication process for Fan-Out Wafer Level Packaging (FOWLP). The project sits at the intersection of advanced microelectronics, heterogeneous integration, and manufacturing process development for high-performance computing, AI, aerospace, and defense applications. The thesis aims to develop high-density vertical interconnections with a pitch below 30 μm, compatible with a manufacturing die-to-wafer (D2W) assembly environment for multi-chip integration. The work addresses key challenges in advanced packaging, including thermomechanical strength, electromigration resistance, warpage control, and accurate die placement during flip-chip bonding. The student will work on creating fine-pitch, ductile heterogeneous solder micro-bumps for active chips on reconstructed wafers. Main research tasks include a literature review on microbump fabrication and ultra-fine-pitch Cu/Ag/Sn micropillars, optimization of clean-room microfabrication steps such as lithography, alignment, and exposure, electroplating parameter optimization, development of thermocompression bonding conditions for D2W assembly, and detailed morphological characterization of micropillar uniformity and quality across wafers. Supervision will be provided by Professor Dominique Drouin as part of an IBM/NSERC Alliance Project on Multi-Chip Heterogeneous Integration for High-Performance Computing. The research will be carried out primarily at the Interdisciplinary Institute for Technological Innovation (3IT) at the Université de Sherbrooke and at the MiQro Innovation Collaborative Center (C2MI) in Bromont. This environment offers access to strong academic-industry collaboration and state-of-the-art facilities in microelectronics, MEMS, and encapsulation. Applicants should hold a Master’s degree or equivalent in micro-nanotechnologies, materials science, or a related engineering field. Experience or interest in clean-room microfabrication, electrical characterization, advanced packaging, and integration processes is desirable. Good communication skills in English or French are required, along with autonomy, adaptability, and teamwork. The application deadline is 30 December 2026 at 00:05 America/Toronto time. Applications are to be sent by email to [email protected].

PhD opportunity at Université de Sherbrooke in advanced microelectronic packaging, focused on new metallurgies for low-temperature hybrid bonding in Fan-Out Wafer Level Packaging (FOWLP). This doctoral project sits at the intersection of mechanical engineering, materials engineering, and chemical engineering, with a strong emphasis on microfabrication, surface characterization, metallurgy, polymers, and bonding process development. The research addresses a central challenge in next-generation packaging: copper-based hybrid bonding can suffer from oxidation and requires high processing temperatures. The project will explore alternative metallurgies and protection strategies to enable reliable low-temperature bonding for high-density interconnects. The thesis aims to develop and characterize alternative metals for polymer-based hybrid bonding, optimize barrier layers or coatings for copper protection, and define die-to-wafer bonding conditions that produce a robust interface. The candidate will carry out morphological, electrical, and mechanical characterizations to assess adhesion quality and interface reliability. The work is expected to contribute to more compact, powerful microelectronic systems for applications such as artificial intelligence, aerospace, and high-performance computing. The research will be conducted within the Interdisciplinary Institute for Technological Innovation (3IT) at Université de Sherbrooke and the C2MI in Bromont, in a collaborative environment with researchers, students, and industry partners. The project is supervised by Prof. Dominique Drouin as part of the IBM/NSERC Research Chair in Heterogeneous Multi Chip Integration for High Performance Computing. The position offers access to state-of-the-art facilities, cleanroom training, and multidisciplinary industrial research exposure. Applicants should hold a Master’s degree or equivalent in mechanical engineering, nanotechnology, materials science, chemistry, or a related field. Strong experimental skills are expected, along with autonomy, adaptability, teamwork, and interest in innovation. French or English communication ability is required. Application deadline: 30 December 2026. To apply, email [email protected].