Arizona State University
6 days ago
PhD Positions in Advanced Semiconductor Packaging, Photonics Integration, and MEMS at Arizona State University Arizona State University in United States
Degree Level
PhD
Field of study
Mechanical Engineering
Funding
All PhD students are fully funded.
Country
United States
University
Arizona State University

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About this position
PhD positions are open at Arizona State University in the HI-Micro Lab (Heterogeneous Integration & Microsystems Laboratory), led by Prof. Hai Liu in the School of Electrical, Computer and Energy Engineering.
The openings focus on advanced semiconductor packaging, heterogeneous integration, photonics packaging and integration, and MEMS/microsystems. Specific topics include 2.5D/3D packaging, wafer-level packaging, advanced bonding, PIC-TFLN integration, laser coupling, optical interconnects, high-SNR MEMS microphones, ultrasonic transducers, and optical MEMS.
The research is aimed at high-performance computing, optical interconnects, and advanced sensing. The post highlights ASU’s location in the Phoenix semiconductor hub, with nearby industry connections such as Intel, TSMC, Amkor, Microchip, and onsemi.
Applicants with backgrounds in EE, materials science, mechanical engineering, physics, optics, or acoustics are encouraged to apply. Interest in cleanroom microfabrication and packaging is a plus, and prior research experience is preferred but not required.
Funding: all PhD students are fully funded.
How to apply: email your CV, transcripts, and a brief research statement to [email protected].
Funding details
All PhD students are fully funded.
What's required
Applicants should have backgrounds in electrical engineering, materials science, mechanical engineering, physics, optics, or acoustics. Hands-on interest in cleanroom microfabrication and packaging is a plus. Prior research experience is preferred but not required.
How to apply
Email your CV, transcripts, and a brief research statement to [email protected].
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