University of Twente
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Postdoc in Wafer Bonding Physics for 3D Chip Integration University of Twente in Netherlands
Degree Level
Postdoc
Field of study
Mechanical Engineering
Funding
2-year full-time postdoctoral appointment. Salary is gross monthly €3,706 to €5,760 depending on experience and qualifications, with Dutch university benefits including 8% holiday allowance, 8.3% year-end bonus, pension scheme, and campus sports access.
Deadline
Oct 17, 2026
Country
Netherlands
University
University of Twente

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About this position
Postdoctoral position at the University of Twente in wafer bonding physics for 3D chip integration.
This 2-year postdoc is hosted in the XUV Optics group within the MESA+ Institute for Nanotechnology at the University of Twente. The project explores the detailed physics behind wafer-to-wafer bonding for next-generation 3D chip integration, combining surface science, advanced metrology, semiconductor process development, and close collaboration with industrial partners.
You will develop and validate experimental methods to study wafer bonding in a quantitative, physics-based way. The work includes wafer bonding measurements, surface and interface analysis, and interpretation of how surface properties and wafer morphology affect bonding performance. Relevant techniques mentioned include AFM, WLI, contact-angle measurements, XPS, FTIR, infrared metrology, and related surface-analysis methods.
Eligibility highlights: a PhD in materials science, surface science, applied physics, physical chemistry, nanotechnology, mechanical engineering, or a related field; experience with surfaces, interfaces, thin films, wafer processing, adhesion, or semiconductor materials; strong English communication skills; and an interest in quantitative data analysis and physical modeling.
Funding and conditions: full-time appointment for up to 2 years. Salary is gross monthly €3,706–€5,760 depending on experience and qualifications, plus Dutch university benefits such as holiday allowance, year-end bonus, pension, and campus sports access.
Application deadline: 17 October 2026. Apply online and submit a cover letter, CV, publications if applicable, proof of English proficiency if available, and two references.
Funding details
2-year full-time postdoctoral appointment. Salary is gross monthly €3,706 to €5,760 depending on experience and qualifications, with Dutch university benefits including 8% holiday allowance, 8.3% year-end bonus, pension scheme, and campus sports access.
What's required
Applicants must hold a PhD degree in materials science, surface science, applied physics, physical chemistry, nanotechnology, mechanical engineering, or a related field. Experience with experimental research on surfaces, interfaces, thin films, wafer processing, adhesion, or semiconductor-related materials is required. Familiarity with characterization techniques such as AFM, WLI, contact-angle measurements, XPS, FTIR, infrared metrology, ellipsometry, or related surface-analysis methods is preferred. Candidates should be able to connect experimental results to physical models and quantitative data analysis, work accurately with advanced laboratory equipment, work independently, collaborate in interdisciplinary academic and industrial settings, and communicate fluently in English. IELTS or TOEFL proof is requested if available.
How to apply
Apply online via the 'Apply now' button before 17 October 2026. Upload a cover letter, CV with courses/grades and publications if applicable, proof of English proficiency if available, and contact details for two references. For questions, contact Wesley van den Beld by email.
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