Shimane University
3 days ago
Postdoctoral Fellowship in Thermal Engineering and Metal Additive Manufacturing at Shimane University Shimane University in Japan
Degree Level
Postdoc
Field of study
Computer Science
Funding
Full funding availableDeadline
Aug 31, 2026
Country
Japan
University
Shimane University

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About this position
Shimane University’s Next Generation Tatara Co-Creation Centre (NEXTA) is recruiting 2 postdoctoral research fellows for research in manufacturing technology and thermal engineering, with a strong emphasis on metal additive manufacturing for space applications.
The position is embedded in the national “Next Generation TATARA Project” in Shimane Prefecture and is sponsored by the JAXA Space Strategy Fund. Research will be carried out under Prof. Junji Shinjo and in collaboration with industry and domestic/overseas universities. The lab environment highlights mesoscale simulation for metal materials processing, including melting/solidification, grain growth, defect control, fume/laser interaction, data utilization, and process optimization.
Applicants with backgrounds in thermal engineering, fluid mechanics, metal materials, applied mathematics, programming, or optimization are encouraged. Strong self-coding ability in Fortran, C, or similar languages is required. A doctorate is required, or the applicant must be prospectively able to obtain one.
The appointment is full-time, contract-based, and non-tenure-track. Salary is listed as 4–6 million yen per year, with various allowances and transportation expenses available. The work location is Matsue Campus, Shimane University in Shimane, Japan.
Applications are due 2026-08-31. To apply, prepare a unified PDF containing the CV, achievement list, copies of three main papers, paper summaries, research background and future ambitions, and contact details for two referees, then email it to [email protected].
Shortlisted candidates will be invited to an interview and research presentation. The university also notes support for English-speaking faculty and encourages female candidates.
Funding details
Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.
How to apply
Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.
More information can be found here
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