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Tampere University

Postdoctoral Fellowships in Next-Generation Semiconductor Technologies at Tampere University Tampere University in Finland

Degree Level

Postdoc

Field of study

Electrical Engineering

Funding

Full funding available

Deadline

Aug 31, 2026

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Country

Finland

University

Tampere University

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Keywords

Electrical Engineering
Materials Science
Silicon Technology
Physics
Post Doc
Electronics

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About this position

FutureChips at Tampere University is inviting applications for 12 postdoctoral fellowships in next-generation semiconductor technologies / chip technologies. This is a research opportunity for early-career researchers interested in semiconductor devices, electronics, materials science, and related areas.

The programme is based in Tampere, Finland, and fellows are expected to relocate there. According to the programme page, FutureChips is a new postdoctoral programme offering a 36-month fellowship for excellent researchers in the field of next-generation semiconductor technologies. The first call is open from 1 July to 31 August 2026, and selected fellows are expected to start in July 2027.

The post announces a launch event and several info sessions for prospective applicants, including a live Q&A and presentations about the Tampere University ecosystem, FiCCC, Chips from Tampere, and research groups. These sessions are intended to help applicants understand the programme and application process.

No specific supervisor names, degree prerequisites beyond postdoctoral level, language-test waivers, or stipend amount are stated in the post content provided. For questions, applicants can contact [email protected] or use the official recruitment/application link.

Research keywords: semiconductor technologies, chip technologies, postdoctoral research, electronics, materials science, device physics.

Funding details

Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.

How to apply

Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.

More information can be found here

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