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Johns Hopkins University

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Postdoctoral Research Associate in Reactive Metal Powders and Combustion Behavior Johns Hopkins University in United States

Degree Level

Postdoc

Field of study

Chemical Engineering

Funding

Full funding available

Deadline

Sep 30, 2026

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Country

United States

University

Johns Hopkins University

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Keywords

Chemical Engineering
Materials Science
Artificial Intelligence
Metallurgy
X-ray Diffraction
Transmission Electron Microscopy
Physics

About this position

Johns Hopkins University is advertising a Postdoctoral Research Associate position focused on reactive metal powders, materials science and engineering, and combustion/oxidation behavior. The project is primarily experimental and includes fabricating powders via ultrasonic atomization and characterizing their size, morphology, microstructure, and combustion behavior.

The role is closely connected to a computational effort aimed at developing an AI-based model of combustion behavior. The successful candidate will work with the Weihs Group, collaborators at Johns Hopkins, and members of the Defense Threat Reduction Agency (DTRA)-funded Materials Science in Extreme Environments (MSEE) University Research Alliance. There may also be opportunities to interact with nearby federal research laboratories.

Eligibility highlights: a PhD in Materials Science and Engineering or a related field is required. Applicants should have experience in materials fabrication and/or characterization, especially metals. Preferred expertise includes vacuum systems, powder metallurgy, electron microscopy, X-ray diffraction, ignition experiments, and combustion measurements.

Application: send a cover letter, updated CV, and two example publications to Professor Tim Weihs at [email protected] with the subject line Postdoc RA: Reactive Metal Powders. Zoom interviews are expected to begin in July, and the goal is to fill the position by 2026-09-30.

Funding details

Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.

How to apply

Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.

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