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Up to 30% off — ends 2 Aug
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Mai Thanh Thai
4 months ago
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Postdoctoral Researcher in Soft Materials and Soft Robotics at VinUniversity (Materials Science, Mechanical Engineering, Robotics) VinUniversity in Vietnam
Degree Level
Postdoc
Field of study
Mechanical Engineering
Funding
Full funding availableDeadline
Jun 30, 2026
Country
Vietnam
University
VinUniversity

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About this position
The Center for Materials Innovation & Technology (CMIT) at VinUniversity, Hanoi, is seeking a Postdoctoral Researcher specializing in soft materials and soft robotics. This multidisciplinary project focuses on the design, synthesis, and integration of advanced functional materials—including elastomers, hydrogels, liquid crystal elastomers, and conductive composites—into adaptive soft robotic systems. The research bridges materials science, mechanical engineering, and robotics, with applications in wearable technologies, biomedical devices, and autonomous soft machines.
Key responsibilities include designing and characterizing advanced soft materials, fabricating soft robotic components using molding, 3D printing, and microfabrication, and integrating these materials into functional systems for actuation, sensing, and environmental responsiveness. The postdoctoral researcher will also study structure–property–function relationships and co-supervise graduate students.
Applicants should have a doctorate in materials science or a closely related field, a strong publication record, and the ability to work independently and collaboratively in an interdisciplinary environment. The position offers a competitive salary (commensurate with experience), opportunities for publishing and presenting research, and a dynamic, international research setting. Vietnamese candidates are especially encouraged to apply.
To apply, submit your application via the provided link or contact Assistant Professor Mai Thanh Thai at [email protected]. The deadline for applications is June 30, 2026.
For more information, visit the VinUniversity job portal or reach out to the PI directly.
Funding details
Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.
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