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Publisher
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NVIDIA

Senior Power Integrity Engineer - LPU Packaging at NVIDIA NVIDIA Corporation in Taiwan

Degree Level

not provided

Field of study

Electrical Engineering

Funding

Full funding available
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Country

Taiwan

University

NVIDIA

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Keywords

Electrical Engineering
Materials Science

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About this position

NVIDIA is recruiting a Senior Power Integrity Engineer - LPU Packaging in Taiwan. This is a technical industry opening focused on power integrity, power delivery network (PDN) design, and chip-package-board co-design for advanced GPU/accelerator packaging.

The role involves defining best-in-class power delivery practices from die/package through board, tray, and rack levels; owning PI specifications and methodology; architecting package-level PDNs; driving system-level PI design; performing PI extraction and simulation; building reusable PI models (SPICE, S-parameter, IBIS-AMI); and validating designs in the lab against measured impedance, noise, and droop.

Relevant study and research areas include Electrical Engineering, Materials Science, signal integrity, high-speed SerDes, HBM, FCBGA, and 2.5D/3D integration. The posting emphasizes experience with large GPUs, ASICs, or CPUs, board-level PDN planning, decap placement, VRM interfaces, and simulation tools such as PowerSI, PowerDC, Sigrity, RedHawk, Totem, HFSS, SIwave, ADS, or SPICE.

Eligibility highlights: MS or PhD in Electrical Engineering or a related field, or equivalent experience; 10+ years in power integrity; strong hands-on experience with advanced packaging and lab validation equipment such as VNAs and oscilloscopes.

How to apply: submit an English resume through the NVIDIA careers site. The post includes the job link and a LinkedIn reference link.

Funding details

Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.

How to apply

Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.

More information can be found here

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