Stefan Preble

Rochester Institute of Technology is advertising an immediate Postdoctoral Associate opening in Photonic Integrated Circuit (PIC) Packaging with Professor Stefan Preble in Microsystems Engineering. The research focuses on enabling emerging PIC applications through microtransfer printing and 3D nanopatterning , including photonic wire bonds and micro-optics . This is a strong fit for candidates interested in photonics, integrated photonic devices, nanofabrication, and advanced packaging technologies. The post is based at Rochester Institute of Technology in Rochester, New York, United States . It is a postdoctoral role rather than a PhD or master's opening. The announcement says applications are being reviewed immediately on a rolling basis and the position will remain open until filled. No specific stipend, funding package, or detailed eligibility criteria are listed in the post. Interested applicants should reach out to the hiring professor and follow the job posting/application route associated with the position.