Stefan Preble
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Posted Yesterday
Postdoctoral Associate in Photonic Integrated Circuit Packaging Rochester Institute of Technology in United States
Degree Level
Postdoc
Field of study
Electrical Engineering
Funding
Postdoctoral Associate position; funding details, stipend, and benefits are not specified in the post.
Country
United States
University
Rochester Institute of Technology

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About this position
Rochester Institute of Technology is advertising an immediate Postdoctoral Associate opening in Photonic Integrated Circuit (PIC) Packaging with Professor Stefan Preble in Microsystems Engineering.
The research focuses on enabling emerging PIC applications through microtransfer printing and 3D nanopatterning, including photonic wire bonds and micro-optics. This is a strong fit for candidates interested in photonics, integrated photonic devices, nanofabrication, and advanced packaging technologies.
The post is based at Rochester Institute of Technology in Rochester, New York, United States. It is a postdoctoral role rather than a PhD or master's opening. The announcement says applications are being reviewed immediately on a rolling basis and the position will remain open until filled.
No specific stipend, funding package, or detailed eligibility criteria are listed in the post. Interested applicants should reach out to the hiring professor and follow the job posting/application route associated with the position.
Funding details
Postdoctoral Associate position; funding details, stipend, and benefits are not specified in the post.
What's required
Applicants should be passionate about advancing next-generation PIC packaging technologies. The post is for a Postdoctoral Associate and is open immediately; no additional formal requirements are stated in the post.
How to apply
Applications are being reviewed immediately on a rolling basis. Interested candidates should connect with Stefan Preble and apply through the linked Rochester Institute of Technology job posting.
More information can be found here
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