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Saravanan Yuvaraja

3 weeks ago

Postdoctoral Position in Semiconductor Devices, Oxide Semiconductors, and 2D Materials at MIT Lab @ EIT Ningbo Eastern Institute of Technology, Ningbo in New Zealand

Degree Level

Postdoc

Field of study

Electrical Engineering

Funding

Full funding available
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Country

New Zealand

University

Eastern Institute of Technology

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Keywords

Electrical Engineering
Materials Science
Device Fabrication
2d Material

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About this position

MIT Lab @ the Eastern Institute of Technology (EIT), Ningbo is advertising a postdoctoral position in experimental semiconductor research.

The lab focuses on oxide semiconductor devices, 2D material-based devices, thin-film electronics, multidimensional integration, and advanced device testing. Research topics include cleanroom-based device fabrication, transistor fabrication and characterization, electrical characterization, device physics, and data analysis. Example materials and systems mentioned include IGZO, In2O3, ZnO, SnO2, MoS2, WS2, WSe2, graphene, and h-BN.

The position is hosted by MIT Lab under Saravanan Yuvaraja, Assistant Professor and PI at EIT Ningbo. The lab describes itself as an experimental group working on emerging semiconductor devices, integration strategies, and future computing and sensing applications, with access to state-of-the-art cleanroom and characterization facilities, including the YMEC cleanroom platform.

Eligibility highlights: applicants should have completed or be close to completing a PhD in Electrical Engineering, Materials Science, Applied Physics, Nanotechnology, Semiconductor Devices, or a related field. Strong hands-on experimental experience is emphasized.

Funding: salary is listed as 300,000–500,000 RMB per year, including government subsidies. The post also highlights strong publication support, mentoring opportunities, and the chance to help establish a new experimental research laboratory.

Application: send a CV with full publication list, a brief email describing relevant expertise, and a summary of fabrication/characterization experience to the contact email. Applications are reviewed on a rolling basis until the position is filled.

Funding details

Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.

How to apply

Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.

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