Walid Gaaloul
1 week ago
Postdoc in LLM-based Software and Data Engineering for Cloud-Edge-IoT Continuum Télécom SudParis in France
Degree Level
Postdoc
Field of study
Computer Science
Funding
Full funding availableDeadline
Aug 15, 2026
Country
France
University
Télécom SudParis

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About this position
Postdoc opportunity at Télécom SudParis (Institut Polytechnique de Paris) in LLM-based software and data engineering for the Cloud–Edge–IoT continuum.
The project focuses on applying generative AI and large language model tooling to service orchestration, automated deployment and monitoring, anomaly detection, resource usage prediction, and continuous cyber posture assessment across heterogeneous cloud, edge, and IoT infrastructures. The work is motivated by real-world challenges in multi-cloud environments, smart cities, Industry 4.0, and connected vehicles, with attention to security, resilience, vendor lock-in, and compliance contexts such as NIS2 and DORA.
The post is hosted by Télécom SudParis, and the announcement is made by Walid Gaaloul. The research direction combines computer science, information technology, and cloud/edge systems engineering, with industrial validation on real use cases.
Eligibility highlights: PhD/doctorate obtained less than 3 years ago; strong practical experience with Generative AI/LLM tooling; solid cloud computing background; programming skills in Python, Java, C, and C++. Helpful extras include ML experience, Docker/Kubernetes/Terraform, and blockchain/BPM knowledge.
Application: send a cover letter and CV by 15 August 2026 to [email protected]. A linked application page is also provided in the post.
Funding details
Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.
How to apply
Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.
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