Donghun Kim
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Postdoctoral Fellow in Materials Science and AI for Autonomous Materials Discovery at KAIST Korea Advanced Institute of Science and Technology in South Korea
Degree Level
Postdoc
Field of study
Computer Science
Funding
Full funding availableDeadline
December 31, 2026Country
South Korea
University
Korea Advanced Institute of Science and Technology

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About this position
KAIST’s CAIM Lab, part of the Sustainable Materials Institute for the Post-AI Era (SMI-PAI), is recruiting an InnoCORE Postdoctoral Fellow in materials science and artificial intelligence. The position is led by Prof. Donghun Kim in the Department of Materials Science and Engineering at the Korea Advanced Institute of Science and Technology (KAIST) in Daejeon, South Korea.
The research themes include self-driving laboratories for autonomous materials discovery, generative AI for materials design, and multiscale modeling with machine learning potentials (MLP). Target application areas include catalysis, battery, and solar cells. This is a strong fit for candidates working at the intersection of materials science, AI/ML, computational modeling, and data-driven discovery.
The postdoctoral appointment offers an annual salary of KRW 90,000,000, inclusive of statutory insurances and benefits. The contract can run for up to 4.5 years and is renewed annually based on performance. The stated start date is after May 1, 2026, with flexibility for negotiation.
Eligibility highlights: applicants must have earned a PhD within the last 5 years. The post also notes a preference for candidates currently based at top-tier universities or research institutes in the US, Canada, or Europe, and for those with a strong publication record in materials science and AI.
To apply, email your CV and a brief research statement directly to Prof. Donghun Kim at [email protected]. The deadline is April 21, 2026, though applications may close earlier if the position is filled.
Funding details
Full funding including tuition fees and living expenses is available for this position. The scholarship covers all educational costs and provides a monthly stipend.
How to apply
Please submit your application including a cover letter, CV, academic transcripts, and contact information for two references. Applications should be sent via the online portal before the deadline.
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