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University of Twente
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Postdoctoral Position on Wafer Bonding Physics for 3D Chip Integration University of Twente in Netherlands
Degree Level
Postdoc
Field of study
Experimental Physics
Funding
Gross salary between €3,706 and €5,760 per month depending on experience and qualifications, plus 8% holiday allowance, 8.3% year-end bonus, and pension scheme.
Deadline
Nov 17, 2026
Country
Netherlands
University
University of Twente
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About this position
This postdoctoral project at the University of Twente focuses on the physics of wafer-to-wafer bonding for future 3D chip integration. The work addresses an important challenge in semiconductor technology: understanding how surface properties and wafer morphology influence bonding quality, rather than relying on empirical optimization alone.
You will develop and validate experimental methods to study wafer bonding in a quantitative, physics-based way. The project combines bonding measurements with advanced surface metrology, with a strong emphasis on building predictive relations between measurable wafer surface properties and bonding performance for next-generation stacked chip architectures.
The position is based in the XUV Optics group, embedded in the MESA+ Institute for Nanotechnology. The group works on thin films, surfaces, interfaces, and optical materials, and is connected to high-tech applications through close collaboration with industrial partners. You will be part of a research environment that combines hands-on experimentation, data analysis, and physical interpretation.
The MESA+ NanoLab provides extensive cleanroom infrastructure and state-of-the-art tools for materials fabrication, surface analysis, and nanoscale characterization, supporting the experimental nature of the project.
The post is research-intensive and industrially relevant, centered on quantitative study of bonding mechanisms for advanced semiconductor integration.
Funding details
Gross salary between €3,706 and €5,760 per month depending on experience and qualifications, plus 8% holiday allowance, 8.3% year-end bonus, and pension scheme.
What's required
A PhD degree in materials science, surface science, applied physics, physical chemistry, nanotechnology, mechanical engineering, or a related field is required. Candidates should have experience with experimental research on surfaces, interfaces, thin films, wafer processing, adhesion, or semiconductor-related materials, and be familiar with one or more characterization techniques such as AFM, WLI, contact-angle measurements, XPS, FTIR, infrared metrology, ellipsometry, or related surface-analysis methods. Applicants should be interested in connecting experimental results to physical models and quantitative data analysis, enjoy hands-on experimental work with advanced laboratory equipment, work independently with a creative mindset, and have good team spirit for interdisciplinary collaboration with academic and industrial partners. Proficiency in English is required, with the ability to communicate clearly in meetings, reports, and scientific publications. Proof of English proficiency (IELTS or TOEFL) is requested if available.
How to apply
Apply via the 'Apply now' button on the AcademicTransfer page before 2026-11-17. Include a cover letter, CV with courses/grades and any publications/references, proof of English proficiency if available, and contact details for two references.
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Prepare your application
Review drafts and confirm requirements with the university.
Make your next move.
Prepare your application
Review drafts and confirm requirements with the university.