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CNRS

Just Landed

Postdoctorant en modélisation thermique et intégration mécanique des électroniques d'instrumentation scientifique CNRS in France

Degree Level

Postdoc

Field of study

Mechanical Engineering

Funding

Available

Deadline

Dec 1, 2026

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Country

France

University

CNRS

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Keywords

Mechanical Engineering
Electrical Engineering
Materials Science
Aerospace Engineering
Heat Transfer
Physics

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About this position

This postdoctoral project focuses on the thermal modelling and mechanical integration of WFEE instrumentation electronics. The recruited researcher will develop and validate an analytical thermal model for the WFEE EM engineering model in order to predict operating temperatures, quantify thermal gradients, and identify the main heat-dissipation paths across the electronics chain.

The work is centred on a simplified thermal network representing heat sources, active components, and effective conductances across the interfaces between ASIC chips, ceramic packages, interposers, printed circuit boards, and the mechanical structure. The aim is to produce a predictive tool that can guide design choices without requiring exhaustive geometric simulation.

The project also includes experimental thermal characterisation of existing and newly developed WFEE boards, together with the preparation and execution of tests in the APC clean-room space simulator. These measurements will be used to characterise component temperatures, observe gradients, and validate or refine the analytical model.

In addition, the postdoctoral researcher will contribute to checking the design and test procedures against applicable CNES requirements and relevant space standards, including ECSS. Particular attention will be paid to the integration of ASICs in JLCC and CQFP ceramic packages with an interposer, with the goal of improving interconnections, reducing bonding lengths, and enhancing thermal dissipation.

The role also involves producing technical reports and scientific publications describing the modelling, characterisation, and thermal integration methodology developed for WFEE electronics within a space-oriented engineering environment.

Funding details

Available

How to apply

Apply through the provided CNRS/Choisir le service public application link. Follow the instructions on the posting page and submit the required application materials before the deadline.

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